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Rotary Polishing - メーカー・企業4社の製品一覧とランキング

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Rotary grinding processing

Fix the workpiece with magnetic force and grind! Suitable when the upper and lower allowances are different.

We would like to introduce the "Rotary Grinding Process" of Tateishi Fiber Co., Ltd., which has good surface roughness (approximately Rz3.2). This process is suitable when the upper and lower machining allowances are different. The workpiece is fixed using magnetic force and grinding is performed. Additionally, the size of the workpieces that can be processed by our machines ranges from Φ11 to Φ180mm, with a thickness of t = 1 to 30mm. 【Processing Example: Flange】 ■Dimensional Tolerance: t = 7 +0.5 -0.2 ■Surface Roughness: Ra0.2 ■Remarks ・Flatness 0.05 ・Care should be taken to avoid scratches as it is a sealing surface. *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Rotary polishing

From single items to mass production, we can accommodate your needs! Introducing our specialty in flat grinding processing.

"Rotary grinding" is a method of processing where both the workpiece and the grinding wheel rotate while performing the grinding operation. It can grind large items with a diagonal size of up to 1200 mm. Furthermore, it has 2 to 3 times the productivity compared to flat grinding machines, making it suitable for mass production. [Features] - Capable of grinding large items with a diagonal size of up to 1200 mm - Supports both single items and mass production - Accommodates products with different upper and lower allowances - Can achieve a surface roughness of approximately Rz0.8 *For more details, please download the PDF or feel free to contact us.

  • Grinding Machine
  • Processing Contract
  • Wafer processing/polishing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

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Rotary polishing

Both pre-heat-treated and post-heat-treated workpieces can be polished! We perform polishing after heat treatment with reliable technology.

Our company offers "rotary grinding." Rotary grinding is a flat grinding method where the workpiece is set on a rotating table. The rotating table pulls the workpiece using magnetic force, and it is ground with a grinding wheel from above. By performing rotary grinding after heat treatment, it becomes possible to carry out additional processing immediately after delivery, leading to time savings, so we highly recommend it. 【Features】 ■ Suitable for grinding workpieces with a large surface area ■ Excellent for mass production as it can process multiple items at once ■ Can grind both workpieces before hardening and those after hardening *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

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What is rotary polishing?

It is possible to apply the whetstone to the entire grinding area of the product! It is often used for products with large surfaces!

"Rotary grinding" refers to a grinding process performed using a rotary grinding machine. The workpiece is placed on a circular table, and grinding is conducted while rotating the table against the upper surface of the product. Since the grinding wheel can be applied to the entire grinding area of the product, it is often used for products with large surfaces and allows for high grinding efficiency. [Features] ■ Grinding process performed using a rotary grinding machine ■ The grinding wheel can be applied to the entire grinding area of the product ■ Often used for products with large surfaces ■ Enables grinding with high efficiency *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

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